師資人員	首頁師資人員專任教師

傅尹坤 教授　Yiin-Kuen Fuh 辦公室： (Office) E4-268 專線電話： (Tel) 03-4267305 校內分機： (Campus Extension) 34305 傳真電話: (Fax) 03-4254501 E-mail： mikefuh@ncu.edu.tw

論文著作 (Publications)

題目 作者姓名 期刊名稱 出版 年份 期別及 起訖頁數 期別種類 A fully encapsulated piezoelectrictriboelectric hybrid nanogenerator for energy harvesting from biomechanical and environmental sources Tien Hsi Lee, Chun Yu Chen, Chen Yu Tsai, Yiin-Kuen Fuh* eXPRESS Polymer Letters,(SCI, IF 3.064) 2019 13(6):533-542 SCI 3D printed acoustic metamaterials with microscale gaps as sound-absorbing mask for the patients of Tourette syndrome" Chang-Wei Hsueh, Tong-Yuan Zhong, Chih-Chun Hsu, Yiin-Kuen Fuh* Microsystem Technologies 2019 25(2). 551-559 SCI Large-scale data analysis of PECVD Amorphous Silicon Interface Passivation layer via the Optical emission spectra for parameterized PCA Hung-Jui Huang, Li-Han Kau1, Ho-Song Wang, Yu-Lin Hsieh, Chien-Chieh Lee, Yiin-Kuen Fuh*, Tomi T. Li International Journal of Advanced Manufacturing Technology 2019 97, 5-8, 2469-2475 SCI Ball-milled recycled lead graphite-pencils as highly stretchable and low-cost thermal interface materials Chun-An Liao, Yee-Kwan Kwan, Tien-Chan Chang, Yiin-Kuen Fuh* Polymers, 2018 10(7), 799 SCI Near-Field Electrospun Piezoelectric Fibers as Sound-Sensing Element Tien Hsi Lee, Chun Yu Chen, Chen Yu Tsai and Yiin-Kuen Fuh* Polymers, 2018 10(7), 692 SCI Highly stretchable thermal interface materials with uniformly dispersed network of exfoliated graphite nanoplatelets via ball milled processing route T.C. Chang, Z.Y. Lin, C.A. Liao, Yiin-Kuen Fuh* Microsystem Technologies 2018 accepted SCI Gas Forming of Shallow Rounded Rectangular Pan using Aluminum-alloy Sheets J.Y. Wang, Chun-Lin Chu, Yiin-Kuen Fuh, Shyong Lee International Journal of Advanced Manufacturing Technology 2018 accepted SCI Effects of Etching Variations on GeSi Channel Formation and Device Perfor-mance Jiann-Lin Chen, Chun-Lin Chu, Yiin-Kuen Fuh Nanoscale Research Letters 2018 accepted SCI Ball milled dispersed network of graphene platelets as thermal interface materials for high-efficiency heat dissipation of electronic devices T.C. Chang, Yiin-Kuen Fuh*, R. Z. Lee, Z.Y. Lin Journal of MicroNanolithography, MEMS, and MOEMS (JM3) 2018 accepted SCI Deformation mechanism of forging tool for multi-stage forming of deep groove ball bearing C.C. Hsu, J.H. Hwang, W.C. Chen, Yiin-Kuen Fuh*, Journal of Engineering Manufacture 2018 accepted SCI

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