帳號
密碼
 
師資人員   首頁師資人員專任教師

林景崎 教授 Lin, Jing-Chie
辦公室:
(Office)
E6-B134
專線電話:
(Tel)
03-4227151
校內分機:
(Campus Extension)
34909
傳真電話:
(Fax)
03-4254501
E-mail: jclincom@cc.ncu.edu.tw

論文著作 (Publications)
題目 作者姓名 期刊名稱 出版
年份
期別及
起訖頁數
期別種類
Effect of annealing on morphology, optical reflectivity, and stress state of Al-(0.19-0.53) wt. % Sc thin films prepared by magnetron sputtering J. C. Lin* , H. L. Liao, W. D. Jehng, C. A. Tseng, J. J. Shen, S. L. Lee, Surface & Coatings Technology 2010 Volume 205, December, pp.S146-S151
Effects of Cu content on microstructure and mechanical properties of Al-14.5Si-0.5Mg alloy Wu, C. T. Wu, S. L. Lee*, M. H. Hsieh, J. C. Lin Materials Characterization 2010 61期,P.1074-P.1079
Effect of spinning deformation processing on the wear and corrosion properties of Al-7Si-0.3mg alloys Y. C. Cheng, C. K. Lin, A. H. Tan, J. C. Lin, S. L. Lee* Materials and Manufacturing Processes 2010 25期,P.689-P.695
Investigation of Electrochemical Recovery Coditions for Indium by Cyclic Voltammetry J. C. Lin* , C. A. Tseng, Y. F. Chen Mining & Metallurgy 2010 54期,P.90-P.96
Comparison of the Corrosion Behavior of AA5052 and AA6061 in HCl Solutions J. C. Lin*, G. H. Zeng, T. Z. Teng Journal of Chinese Corrosion Engineering 2010 24期,P.1-P.8
Effects of Mg Content on Microstructure and Mechanical Properties of Al-14.5Si-4.5Cu Alloy C. T. Wu, S. L. Lee, M. H. Hsieh, J. C. Lin* Metallurgical and Materials Transactions A 2010 41A期,P.751-P.757
Effect of annealing on morphology, optical reflectivity, and stress state of Al-(0.19-0.53) wt. % Sc thin films prepared by magnetron sputtering J. C. Lin* , H. L. Liao, W. D. Jehng, C. A. Tseng, J. J. Shen, S. L. Lee Surface & Coatings Technology 2010 205期,P.S146-P.S151
Localized Electrochemical Deposition of Micrometer Copper Columns by Pulse Plating J. C. Lin* , T. K. Chang , J. H. Yang , Y. S. Chen , and C. L Electrochimica Acta 2010 55期,p.1888-p.1894
Fabrication of a micrometer Ni–Cu alloy column coupled with a Cu micro-column for thermal measurement J C Lin, T K Chang, J H Yang, J H Jeng, D L Lee and S B Jiang journal of micromechanics and microengineering 2009 19, 015030
Localized Ni deposition improved by saccharin sodium in the intermittent MAGE process J H Yang, J C Lin, T K Chang, X B You and S B Jiang J. Micromech. Microeng 2009 19,025015

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