帳號
密碼
 
師資人員   首頁師資人員專任教師

陳志臣 教授兼副校長 Chen, Jyh-Chen
辦公室:
(Office)
E4-362
專線電話:
(Tel)
03-4267321
校內分機:
(Campus Extension)
34321
傳真電話:
(Fax)
03-4254501
E-mail: jcchen@cc.ncu.edu.tw

論文著作 (Publications)下載完整著作目錄
題目 作者姓名 期刊名稱 出版
年份
期別及
起訖頁數
期別種類
Growth and Properties of Ru Doped Lithium Niobate Crystal C.-H. Chiang and J.-C. Chen Journal of Crystal Growth 2006 Vol. 294, pp. 323-329
Numerical Simulation of Thermocapillary Nonwetting J.-C. Chen, C.-W. Kuo, and G. P. Neitzel International Journal of Heat and Mass Transfer 2006 Vol.49, pp. 4567-4576
Influence of thermal conductivity on interface shape during growth of sapphire crystal using a heat-exchanger-method C.-W. Lu and J.-C. Chen Journal of Rare Earths 2006 Vol. 24, pp. 222-227
The morphology of an epitaxial Mg-Al spinel layer on a sapphire surface C.-M. Liu, J.-C. Chen, and C.-J. Chen Journal of Crystal Growth 2006 Vol. 292, pp. 302-305
Growth of Mg-Al spinel micro crystals on sapphire surface using a solution-precipitation method C.-M. Liu and J.-C. Chen Applied Physics Letters 2006 Vol. 89, 011912
Influence of the addition of CeO2 on the microstructure and the magnetic properties of yttrium iron garnet ceramic T.-C. Mao and J.-C. Chen Journal of magnetism and magnetic materials 2006 Vol. 302, pp. 74-81
The effect of annealing, precipitation-strengthening, and compressive coating processes on sapphire strength C.-M. Liu, J.-C. Chen, and L. J. Hu Materials Science and Engineering A 2006 Vol. 420, pp. 212-219
Mg doped sapphire crystal fibers grown by the LHPG method C.-M. Liu, C.-H. Chiang, J.-C. Chen Japanese Journal of Applied Physics 2006 Vol. 45, pp. 194-199
The growth of an epitaxial Mg-Al spinel layer on sapphire by solid-state reactions C.-M. Liu, J.-C. Chen, and C.-J. Chen Journal of Crystal Growth 2005 Vol 285, pp. 275-283
Numerical simulation of thermal and microdefect distributions affected by different types of heat shields during the Chzochralski silicon crystal growth J.-C. Chen, F.-S. Hwu, and B. J. Chen Journal of the Chinese Society of Mechanical Engineers 2005 Vol. 126, pp. 87-97

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