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Abstract¡G

The purpose of this study is to investigate the influence of strain ratio and tensile hold time on low-cycle fatigue (LCF) behavior of a lead-free Sn-3.5Ag-0.5Cu solder alloy. A non-contact strain measurement system was developed and applied to the LCF tests to avoid premature failure caused by traditional contact type of extensometers. Fractography analysis with scanning electron microscopy (SEM) was conducted to determine the LCF fracture mechanism for the given solder alloy.

Results showed that LCF life of the given Sn-3.5Ag-0.5Cu, under various combinations of strain amplitude, strain ratio and tensile hold time, could be individually described by a Coffin-Manson relationship for each given testing condition. An increase of strain ratio from R = ¡V1 to 0 and 0.5 would cause a significant reduction of LCF life due to the influence of mean strain instead of mean stress. LCF life was markedly reduced when the hold time at tensile peak strain was increased from 0 to 100 sec as a result of additional creep damages generated during LCF loading. Several modified Coffin-Manson models were proposed to describe the LCF behavior with a consideration of the effects of strain ratio and tensile hold time separately. Based on the success of these modified models, a unified LCF lifetime model was then proposed and did an excellent work in describing the LCF lives for all the given testing conditions with various combinations of strain amplitude, strain ratio and tensile hold time in the current study.

From SEM observations, it could be found that fatigue cracks were initiated at the interphases between ƒÒ-Sn dendrites and eutectic phases. The fatigue cracks propagated and linked up in a mixed mode of intergranular manner along boundaries between ƒÒ -Sn dendrites and eutectic phases and transgranular manner through eutectic phases.


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