帳號
密碼
 
師資人員   首頁師資人員專任教師

李 雄 教授 Lee, Shyong
辦公室:
(Office)
E2-203
專線電話:
(Tel)
x
校內分機:
(Campus Extension)
x
傳真電話:
(Fax)
03-4254501
E-mail: shyong@cc.ncu.edu.tw

論文著作 (Publications)
題目 作者姓名 期刊名稱 出版
年份
期別及
起訖頁數
期別種類
Evaluation on Some Metallic Alloys for SOFC Interconnect C. L. Chu, J. Y. Wang, J. Lee, R. Y. Lee, and Shyong Lee Materials Science Forum 2007 vols.544-545. P.989-P.992
Microstructures and Mechanical Properties of Mg-Li-Zn Alloys as processed by Equal Channel Angular Extrusion J. Lee, J. Y. Wang, C. S. Lee, and Shyong Lee Materials Science Forum 2007 vols.546-549, P.225-P.228
Cavitation characteristics of a superplastic 5083 Al alloy during gas blow forming H. Y. Wu, J. Y. Perng, S. H. Sheu, Shyong Lee and J. Y. Wang Journal of Materials Science 2006 vol.41, P.7441-P.7453
Effect of lubrication on deformation characteristics of a superplastic 5083 Al alloy during bi-axial deformation H. Y. Wu, C. H. Chiu, J. Y. Wang and Shyong Lee Materials Science Engineering 2006 vol.A 427, P.268-P.273
Mechanical properties and microstructures of Various Mg-Li alloys T. C. Chang, J. Y. Wang, C. L. Chu and Shyong Lee Materials Letters 2006 vol.60, P.3272-P.3276
Effect of Al and Mn content on the Mechanical properties of Various ECAE Processed Mg-Li-Zn Alloys J. Y. Wang, T. C. Chang, L. Z. Chang and Shyong Lee Materials Transactions JIM 2006 vol.47, P.971-P.976
Recycling Mg Alloys in Solid State J. Y. Wang, I. N. Lin, T. C. Chang, and Shyong Lee Materials Transactions JIM 2006 vol.47
The measurement of sputtering yields and spectrum of mass and optical emission of sputtered particles induced by ion bombardment of H2O ice C. S. Lee, M. C. Chueh, Y. C. Liu, C. Y. Hsu, S. H. Liu, W. H. Ip and Shyong Lee Nuclear Instruments and Methods in Physics Research 2005 vol.B 240, P.345-P.349
Grain Refining of Magnesium Alloy AZ 31 by ECAE J. Y. Wang, Y. H. Chen, Y. L. Yang and Shyong Lee Materials Science Forum 2005 vol.488-489, P.465
Application of Neural Networks for Grading Textile Yarns H. C. Lien and Shyong Lee Neural Computing and Applications Journal 2004 vol.13, P.185-P.192

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