| 題目 |
作者姓名 |
期刊名稱 |
出版
年份 |
期別及
起訖頁數 |
期別種類 |
| Thermal Stress Analysis of a Planar SOFC Stack |
C.-K. Lin, T.-T. Chen, Y.-P. Chyou, and L.-K. Chiang |
Journal of Power Sources |
2007 |
Vol. 164, No. 1, pp. 238-251 |
SCI |
| Effects of Strain Ratio and Tensile Hold Time on Low-Cycle Fatigue of Lead-Free Sn-3.5Ag-0.5Cu Solder |
C.-K. Lin and C.-M. Huang |
Journal of Electronic Materials |
2006 |
Vol. 35, No. 2, pp. 292-301 |
SCI |
| Creep Properties of Sn-3.5Ag-0.5Cu Lead-Free Solder under Step-Loading |
C.-K. Lin and H.-Y. Teng |
Journal of Materials Science: Materials in Electronics |
2006 |
Vol. 17, No. 8, pp. 577-586 |
SCI |
| Effect of Strain Rate on High-Temperature Low-Cycle Fatigue of 17-4 PH Stainless Steels |
J.-H. Wu and C.-K. Lin |
Materials Science and Engineering A |
2005 |
Vol. 390, No. 1-2, pp. 291-298 |
SCI |
| Creep Rupture of Lead-Free Sn-3.5Ag and Sn-3.5Ag-0.5Cu Solders |
C.-K. Lin and D.-Y. Chu |
Journal of Materials Science: Materials in Electronics |
2005 |
Vol. 16, No. 6, pp. 355-365 |
SCI |
| 凹槽效應對AISI 347不銹鋼腐蝕疲勞性質之影響 |
郭柏甫、林志光 |
防蝕工程 |
2004 |
第18卷，第1期，第41-52頁 |
|
| High-Temperature Fatigue Crack Growth Behavior of 17-4 PH Stainless Steels |
K.-C. Hsu and C.-K. Lin |
Metallurgical and Materials Transactions A |
2004 |
Vol. 35A, No. 9, pp. 3018-3024 |
SCI |
| Fatigue Behavior of AISI 347 Stainless Steel in Various Environments |
C.-K. Lin and I.-L. Lan |
Journal of Materials Science |
2004 |
Vol. 39, No. 23, pp. 6901-6908 |
SCI |
| 不同水媒環境下之AISI 347不銹鋼腐蝕疲勞行為 |
藍一龍、林志光 |
防蝕工程 |
2003 |
第17卷，第1期，第1-11頁 |
|
| Influence of High-Temperature Exposure on the Mechanical Behavior and Microstructure of 17-4 PH Stainless Steel |
J.-H. Wu and C.-K. Lin |
Journal of Materials Science |
2003 |
Vol. 38, No. 5, pp. 965-971 |
SCI |
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