題目 |
作者姓名 |
期刊名稱 |
出版
年份 |
期別及
起訖頁數 |
期別種類 |
Communication--Effect of Free-Carrier Absorption on an Anodized Silicon Surface for Producing Dense and Uniform Nanocrystals |
Benjamin T.-H. Lee* and C.-C. Chiang |
Journal of the Electrochemical Society |
2018 |
165 (3), H99-H101 |
SCI |
Free-Carrier Absorption Assisted Photoelectrochemistry of Silicon |
Benjamin T.-H. Lee*, C.-C. Chiang and Yean-Ren Hwang |
ECS Transactions |
2017 |
80 (10) 1113-1125 |
EI |
Measurement of Thickness of High-Resistivity Substrate By Photoconduction Enhanced Capacitance Displacement Sensor |
Benjamin T. -H. Lee* and M. -C. Lin |
ECS Transactions |
2017 |
77 (11), 1747-1752 |
EI |
Nanoscale Layer Transfer by Hydrogen Ion-Cut Processing: A Brief Review Through Recent U.S. Patents |
Benjamin T.-H. Lee* |
Recent Patents on Nanotechnology |
2017 |
11(1), 42-49 |
SCI |
Eliminating Thickness Measurement Uncertainty of Capacitive Displacement Sensor in High Resistivity Substrate by Photoconduction |
Benjamin T.-H. Lee* and M. -C. Lin |
ECS Journal of Solid State Science and Technology |
2017 |
6(5) 323-325 |
SCI |
Sharpening Si nanocrystals on the bulk surface by nanoscale electrochemistry thru controlling the hole current with the irradiation of near-infrared laser |
C.-C. Chiang and T. -H. Lee* |
JOURNAL OF THE ELECTROCHEMICAL SOCIETY |
2016 |
163 ( 9), E258-E262 |
SCI |
Inhibition Effect of a Laser on Thickness Increase of P-type Porous Silicon in Electrochemical Anodizing |
C. -C. Chiang , Pi-Chun Juan, and T. -H. Lee* |
Journal of the Electrochemical Society |
2016 |
163 (5) H265-H268 |
SCI |
The Suppression Effect of 830nm Laser Irradiation on Porous Silicon Formation |
C. -C. Chiang, Y.-C Huang, P.- C. Juan, F. -S. Lo, and T. -H. Lee* |
ECS Transactions |
2015 |
69(35): 1-7 |
EI |
Modeling a thermionic energy converter using finite-difference time-domain particle-in-cell simulations |
F. -S. Lo, P. S. Lu, B. Ragan-Kelley, A. Minnich, T. -H. Lee, M. C. Lin, and J. P. Verboncoeur |
Physics of Plasma |
2014 |
21, 023510 |
SCI |
Effect of Microwave Processing on Oxygen Plasma-Assisted Bonding Enabling Rapid Layer Transfer |
C. -C. Ho, F. S. Lo, S. C. Jeng, J. -H. Li, H. -H. Chang, and T. -H. Lee* |
ECS Solid State Letters |
2014 |
3(1) P4-P6 |
SCI |