師資人員	首頁師資人員專任教師

李天錫 教授　 Lee, Tien-Hsi 辦公室： (Office) E4-363 專線電話： (Tel) 03-4267302 校內分機： (Campus Extension) 34302 傳真電話: (Fax) 03-4254501 E-mail： benlee@ncu.edu.tw

論文著作 (Publications)

題目 作者姓名 期刊名稱 出版 年份 期別及 起訖頁數 期別種類 Increasing More Bonding Energy in Nitrogen Plasma-activated Wafer Bonding by HF-dip F. -S. Lo, C. C. Chiang, C. Li, and T. -H. Lee ECS Solid-State Letters 2014 3 (8) P102-P104 SCI Thermal Stress Induced Thin Film Transfer from Single-crystal Silicon Layer on Sapphire Substrate F. S. Lo, R. Y. Xu, C. C. Ho, C. Li, and T. -H. Lee* Integrated Ferroelectrics 2013 144.1: 73-78 SCI HFH2O2 Etching for Removal of Damage Layer on As-Transferred Si Layer Formed by Ion-Cut Process C.-C. Ho, C.-H. Huang, B.-S. Chen, Y.-H. Su, K.-J. Chen, C.-S. Hsu and T.-H. Lee* ELECTROCHEMICAL AND SOLID STATE LETTERS 2010 13(7) SCI Low Stress Silicon Layer Transfer onto Quartz Through Hydrogen Capture within Si (BGe) Buried Layer C.-H. Huang, C.-C. Ho, S.-C. Jeng, and T.-H. Lee* ELECTROCHEMICAL AND SOLID STATE LETTERS 2009 Vol. 12, No. 12, H423-H425 SCI Superplasticity of AA5083 alloy as processed by equal channel angular extrusion Hsin-Hwa Chen, Jian-Yih Wang, Jye Lee, Shyong Lee, Tien-Hsi Lee* Journal of Alloys and Compounds 2008 460 (2008) 305–308 SCI Nanoscale thick layer transfer of hydrogen-implanted wafer by using polycrystalline silicon sacrificial layer T.-H. Lee*, C.-H. Huang, Y. Y. Yang, P. W. Li, and T. Suryasindhu Applied Physics Letters 2007 91, 203119 SCI Fabrication of a Nanoscale Single-Crystalline Silicon Thin Film T.-H. Lee*, C.-H. Huang, Y.-Y. Yang, P.-W. Li, T. Suryasindhu, and S. Lee ELECTROCHEMICAL AND SOLID STATE LETTERS 2007 10 (7) K17-K19 SCI Ammonium Hydroxide Effect on Low-Temperature Wafer Y.-L. Chao, Q.-Y. Tong, T.-H. Lee, M. Reiche, R. Scholz, J. C. S. Woo, and U. Goesele ELECTROCHEMICAL AND SOLID STATE LETTERS 2005 8 (3) G74-G77 SCI Onset of blistering in hydrogen-implanted silicon L.-J. Huang, Q.-Y. Tong, Y.-L. Chao, T.-H. Lee, T. Martini, and U. Gosele APPLIED PHYSICS LETTERS 1999 74, 982 SCI Wafer bonding for microsystems technologies U. Goele, A. Schumacher, G. Krauter, M. Reiche, A. Plosl, P. Kopperschmidt, T.-H. Lee, and W.-J. Kim Sensors and Actuators A 1999 74 (1999) 161–168 SCI

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